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Physical and biological properties of albizzia waferboards modified with cross-linking agents
1995 - IRG/WP 95-40043
Chemically-modified low-density waferboards with cross-linking agents were produced using a fast-growing species of hardwood albizzia (Paraserienthes falcata Becker) as a raw materials and isocyanate resin as a glue adhesive. For the chemical modification, the vapor-phase formalization of the boards and the pad-dry-cure treatment of wafers with cross-linking agents were employed. The vapor-phase f...
S Yusuf, Y Imamura, M Takahashi, K Minato
Biodetioration and strength reductions in preservative treated aspen waferboard
1983 - IRG/WP 2195
Experimental aspen waferboards, bonded with liquid or powdered phenol formaldehyde resins and treated by various methods with a wide selection of preservatives, were tested for fungal resistance in accelerated laboratory trials. Mold growth on the surface as well as weight and strength losses due to the actions of decay fungi were determined. Testing of board strength after decay in high and moder...
E L Schmidt, H J Hall, R O Gertjejansen, R C De Groot